JPH0419804Y2 - - Google Patents
Info
- Publication number
- JPH0419804Y2 JPH0419804Y2 JP9265987U JP9265987U JPH0419804Y2 JP H0419804 Y2 JPH0419804 Y2 JP H0419804Y2 JP 9265987 U JP9265987 U JP 9265987U JP 9265987 U JP9265987 U JP 9265987U JP H0419804 Y2 JPH0419804 Y2 JP H0419804Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- lead frame
- chip
- sectional area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265987U JPH0419804Y2 (en]) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9265987U JPH0419804Y2 (en]) | 1987-06-16 | 1987-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63201342U JPS63201342U (en]) | 1988-12-26 |
| JPH0419804Y2 true JPH0419804Y2 (en]) | 1992-05-06 |
Family
ID=30954560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9265987U Expired JPH0419804Y2 (en]) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419804Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3344396B2 (ja) * | 2000-01-18 | 2002-11-11 | サンケン電気株式会社 | リード端子及び半導体装置 |
-
1987
- 1987-06-16 JP JP9265987U patent/JPH0419804Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63201342U (en]) | 1988-12-26 |
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